Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/02/2018
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Application #:
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15419031
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Filing Dt:
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01/30/2017
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Publication #:
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Pub Dt:
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05/25/2017
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Inventors:
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HIROYUKI MORI, KEIJI MATSUMOTO
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Title:
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ELECTRICAL PACKAGE INCLUDING BIMETAL LID
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION IP LAW DEPARTMENT |
| 294 ROUTE 100 |
| P.O. BOX 100 |
| SOMERS, NY 10589-0100 |
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