Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/22/2018
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Application #:
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15066903
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Filing Dt:
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03/10/2016
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Publication #:
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Pub Dt:
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05/25/2017
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Inventors:
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KEJIA PAN, XI LI, JIAN HU, ZHENSHAN WANG, BIN FENG
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Title:
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ELECTRICAL MODULES AND MODULAR ELECTRONIC BUILDING SYSTEMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5176 EVANWOOD AVE., |
| OAK PARK, CALIFORNIA 91377 |
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| 4F ZHONGGUANCUN DREAM LAB, NO.1 HAIDIAN AVE, HAIDIAN DISTRICT |
| BEIJING, CHINA 100000 |
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| ANOVA LAW GROUP, PLLC |
| 21351 GENTRY DRIVE, SUITE 150 |
| STERLING, VA 20166 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE OMITTED INVENTOR'S NAME AND CORRECT SECOND ASSIGNEE STREET ADDRESS PREVIOUSLY RECORDED AT REEL: 038060 FRAME: 0994. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2659 TOWNSGATE ROAD UNIT 213 |
| WESTLAKE VILLAGE, CALIFORNIA 91361 |
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| 4F ZHONGGUANCUN DREAM LAB, NO.1 HAIDIAN AVE, HAIDIAN DISTRICT, |
| BEIJING, CHINA 100000 |
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| ANOVA LAW GROUP, PLLC |
| 21495 GENTRY DRIVE, SUITE 300 |
| STERLING, VA 20166 |
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