Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/10/2020
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Application #:
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14953585
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Filing Dt:
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11/30/2015
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Publication #:
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Pub Dt:
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06/01/2017
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Inventors:
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Qing Cao, Kangguo Cheng, Zhengwen Li, Fei Liu
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Title:
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THREE-DIMENSIONAL INTEGRATION OF NEUROSYNAPTIC CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| WILLIAM E. LEWIS |
| 48 SOUTH SERVICE ROAD, SUITE 100 |
| RYAN, MASON & LEWIS, LLP |
| MELVILLE, NY 11747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129 SAMSUNG-RO (MAETAN-DONG), YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 16677 |
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| NSIP LAW |
| P.O. BOX 65745 |
| WASHINGTON, DC 20035 |
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