Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2019
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Application #:
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15430574
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Filing Dt:
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02/13/2017
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Publication #:
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Pub Dt:
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06/01/2017
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Inventors:
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Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Mark D. Schultz, Todd E. Takken et al
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Title:
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HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORP. - FISHKILL DRAFTING CENTER IP |
| 1101 KITCHAWAN RAOD, ROUTE 134 |
| P.O. BOX 218 |
| YORKTOWN, NY 10589 |
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