Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/24/2018
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Application #:
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15454950
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Filing Dt:
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03/09/2017
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Publication #:
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Pub Dt:
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06/22/2017
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Inventors:
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Heath A. Pois, Wei Ti Lee
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Title:
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SILICON GERMANIUM THICKNESS AND COMPOSITION DETERMINATION USING COMBINED XPS AND XRF TECHNOLOGIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3090 OAKMEAD VILLAGE DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| WOMBLE BOND DICKINSON (US) LLP |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 3090 OAKMEAD VILLAGE DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| WOMBLE BOND DICKINSON (US) LLP |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085 |
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