Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/09/2019
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Application #:
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15461499
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Filing Dt:
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03/17/2017
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Publication #:
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Pub Dt:
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07/06/2017
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Inventors:
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Wen-Chun Liu, Wei-Jen Lai
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Title:
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PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 58,CHAOMA 7TH STREET, SITUN DIST., |
| TAICHUNG CITY, TAIWAN 40757 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2 |
| TAIPEI, 100 TAIWAN |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F.-5, NO. 233, FUXING 2ND RD., AIKOU VIL., ZHUBEI CITY, |
| HSINCHU COUNTY, TAIWAN 302052 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, TAIWAN |
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