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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/10/2018
Application #:
14985009
Filing Dt:
12/30/2015
Publication #:
Pub Dt:
07/06/2017
Inventors:
Keji Matsumoto, Kazushige Toriyama, Keishi Okamoto, Yasumitsu K. Orii
Title:
ELECTRICAL CONNECTING STRUCTURE BETWEEN A SUBSTRATE AND A SEMICONDUCTOR CHIP
Assignment: 1
Reel/Frame:
037387/0050Recorded: 12/30/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/20/2015
Exec Dt:
11/20/2015
Exec Dt:
11/26/2015
Exec Dt:
12/10/2015
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
TUTUNJIAN & BITETTO, P.C.
425 BROADHOLLOW ROAD, SUITE 302
MELVILLE, NY 11747

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