Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15404351
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Filing Dt:
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01/12/2017
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Publication #:
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Pub Dt:
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07/20/2017
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Inventor:
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Ryo Fukuchi
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Title:
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Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1008164 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET |
| SUITE 5 |
| WESTBORO, MA 01581 |
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