Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/24/2020
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Application #:
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15426435
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Filing Dt:
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02/07/2017
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Publication #:
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Pub Dt:
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08/10/2017
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Inventors:
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Atsushi Miki, Kazuki Kanmuri
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Title:
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Laminate For Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Method Of Manufacturing Electronic Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1008164 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET |
| SUITE 5 |
| WESTBORO, MA 01581 |
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Assignment:
2
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| 10-4, TORANOMON 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 100-8164 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE ST |
| ST HELIER, JE1 1BL JERSEY |
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