Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15503093
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Filing Dt:
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02/10/2017
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Publication #:
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Pub Dt:
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08/17/2017
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Inventor:
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Kazuhiro MAENO
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Title:
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BONDING STRUCTURE, BONDING MATERIAL AND BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, TOYODA-CHO |
| KARIYA-SHI |
| AICHI-KEN, JAPAN |
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| SUGHRUE MION PLLC |
| 2100 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20037 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY'S NAME PREVIOUSLY RECORDED AT REEL: 041731 FRAME: 0612. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2-1, TOYODA-CHO |
| KARIYA-SHI |
| AICHI-KEN, JAPAN |
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| SUGHRUE MION PLLC |
| 2100 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20037 |
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05/08/2024 07:56 PM
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