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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15360498
Filing Dt:
11/23/2016
Publication #:
Pub Dt:
08/17/2017
Inventors:
Satoshi Torimi, Masato Shinohara, Youji Teramoto, Norihito Yabuki, Satoru Nogami et al
Title:
METHOD FOR MANUFACTURING THIN SiC WAFER AND THIN SiC WAFER
Assignment: 1
Reel/Frame:
040412/0946Recorded: 11/23/2016Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/14/2016
Exec Dt:
11/14/2016
Exec Dt:
11/14/2016
Exec Dt:
11/14/2016
Exec Dt:
11/14/2016
Exec Dt:
11/14/2016
Assignee:
7-12, TAKESHIMA 5-CHOME, NISHIYODOGAWA-KU
OSAKA-SHI, OSAKA, JAPAN
Correspondent:
WESTERMAN, HATTORI, DANIELS & ADRIAN LLP
1250 CONNECTICUT AVENUE NW,
SUITE 700
WASHINGTON, DC 20036

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