Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/30/2018
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Application #:
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15321528
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Filing Dt:
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12/22/2016
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Publication #:
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Pub Dt:
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08/24/2017
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Inventors:
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Yousuke HIROTA, Takamitsu NAKAMURA, Yutaka SATOU
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Title:
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EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL AND FIBER-REINFORCED MOLDED ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 35-58, SAKASHITA 3-CHOME, ITABASHI-KU |
| TOKYO, JAPAN 174-8520 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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