Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/29/2021
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Application #:
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15057078
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Filing Dt:
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02/29/2016
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Publication #:
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Pub Dt:
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08/24/2017
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Inventors:
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Mingzhu WANG, Nan GUO, Feifan CHEN, Bojie ZHAO, Bo PENG, Zhen HUANG
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Title:
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Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66-68 SHUNYU ROAD, YUYAO |
| NINGBO, ZHEJIANG, CHINA 315400 |
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| RAYMOND Y. CHAN |
| SUITE 128 |
| 108 N. YNEZ AVENUE |
| MONTEREY PARK, CALIFORNIA 91754 |
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