Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2019
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Application #:
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15068002
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Filing Dt:
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03/11/2016
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Publication #:
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Pub Dt:
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09/14/2017
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Inventors:
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Toyohiro Aoki, Kuniaki Sueoka, Akihiro Horibe, Kazushige Toriyama
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Title:
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SOLDER FILL INTO HIGH ASPECT THROUGH HOLES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| TUTUNJIAN & BITETTO, P.C. |
| 425 BROADHOLLOW ROAD |
| SUITE 302 |
| MELVILLE, NY 11747 |
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