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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10032758
Issue Dt:
07/24/2018
Application #:
15257433
Filing Dt:
09/06/2016
Publication #:
20170263595
Pub Dt:
09/14/2017
Inventors:
Yoichiro Kurita, Hideto Furuyama, Fumitaka Ishibashi, Hiroshi Uemura
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
039892/0554Recorded: 09/29/2016Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KURITA, YOICHIRO
Exec Dt:
08/29/2016
FURUYAMA, HIDETO
Exec Dt:
08/29/2016
UEMURA, HIROSHI
Exec Dt:
08/29/2016
ISHIBASHI, FUMITAKA
Exec Dt:
09/08/2016
Assignee:
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN 105-8001
Correspondent:
FOLEY & LARDNER LLP
3000 K ST NW
SUITE 600
WASHINGTON, DC 20007
Assignment: 2
Reel/Frame:
040612/0884Recorded: 11/14/2016Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE DATE THE 4TH INVENTOR ASSIGNED HIS RIGHTS PREVIOUSLY RECORDED ON REEL 039892 FRAME 0554. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
KURITA, YOICHIRO
Exec Dt:
08/29/2016
FURUYAMA, HIDETO
Exec Dt:
08/29/2016
UEMURA, HIROSHI
Exec Dt:
08/29/2016
ISHIBASHI, FUMITAKA
Exec Dt:
09/05/2016
Assignee:
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN 105-8001
Correspondent:
FOLEY & LARDNER LLP
3000 K ST NW
SUITE 600
WASHINGTON, DC 20007

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