Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2017
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Application #:
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15473607
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Filing Dt:
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03/30/2017
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Publication #:
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Pub Dt:
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09/14/2017
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Inventors:
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Bojie ZHAO, Nan GUO, Heng JIANG, Fengsheng XI, Liang DING, Mingzhu WANG, Takehiko TANAKA et al
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Title:
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Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66-68, SHUNYU ROAD, YUYAO CITY, |
| NINGBO, ZHEJIANG, CHINA 315400 |
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| DAVID AND RAYMOND PATENT FIRM |
| 108 N. YNEZ AVE., SUITE 128 |
| MONTEREY PARK, CA 91754 |
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