Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/15/2020
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Application #:
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15615693
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Filing Dt:
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06/06/2017
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Publication #:
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Pub Dt:
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09/21/2017
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Inventors:
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Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han
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Title:
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Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C. |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 053102 FRAME: 0585. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE |
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| KATTEN MUCHIN ROSENMAN LLP |
| 1919 PENNSYLVANIA AVE., NW - SUITE 800 |
| WASHINGTON, DC 20006 |
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Assignment:
3
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CORRECT ERROR IN ASSIGNMENT NAME FROM STATS CHIPPAC, PTE. LTE TO STATS CHIPPAC PTE. LTD (REEL: 038378 FRAME: 0319)
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| SEAN WOODEN |
| 1919 PENNSYLVANIA AVE., SUITE 800 |
| WASHINGTON, DC 20006 |
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