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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/05/2019
Application #:
15614917
Filing Dt:
06/06/2017
Publication #:
Pub Dt:
09/21/2017
Inventors:
Ewald Karl Michael Günther, Andreas Plößl, Heribert Zull, Thomas Veit, Mathias Kämpf et al
Title:
METHOD OF PRODUCING SEMICONDUCTOR CHIPS THAT EFFICIENTLY DISSIPATE HEAT
Assignment: 1
Reel/Frame:
042700/0555Recorded: 06/06/2017Pages: 38
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/03/2013
Exec Dt:
08/22/2013
Exec Dt:
08/23/2013
Exec Dt:
08/26/2013
Exec Dt:
09/02/2013
Exec Dt:
08/22/2013
Exec Dt:
09/02/2013
Exec Dt:
09/16/2013
Assignee:
LEIBNIZSTR. 4
REGENSBURG, GERMANY 93055
Correspondent:
IP GROUP OF DLA PIPER LLP (US)
ONE LIBERTY PLACE
1650 MARKET ST, SUITE 4900
PHILADELPHIA, PA 19103
Assignment: 2
Reel/Frame:
051467/0906Recorded: 01/03/2020Pages: 52
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/18/2019
Assignee:
WERNERWERKSTRASSE 2
REGENSBURG, GERMANY 93049
Correspondent:
OSRAM SYLVANIA INC.
200 BALLARDVALE STREET
ATTN: HEAD OF IP
WILMINGTON, MA 01887

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