Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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15076976
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Filing Dt:
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03/22/2016
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Publication #:
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Pub Dt:
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09/28/2017
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Inventors:
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Feng Wei KUO, Chewn-Pu JOU, Lan-Chou CHO, Wen-Shiang LIAO, Huan-Neng CHEN et al
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Title:
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COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| DUANE MORRIS LLP (TSMC) IP DEPARTMENT |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103-4196 |
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