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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/19/2019
Application #:
15405881
Filing Dt:
01/13/2017
Publication #:
Pub Dt:
09/28/2017
Inventor:
Yonghoon Kim
Title:
SEMICONDUCTOR PACKAGES HAVING REDUCED STRESS
Assignment: 1
Reel/Frame:
044498/0467Recorded: 12/28/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/29/2017
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
ONELLO & MELLO, LLP
3 BURLINGTON WOODS DRIVE
SUITE 203
BURLINGTON, MA 01803

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