Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/09/2019
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Application #:
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15651826
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Filing Dt:
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07/17/2017
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Publication #:
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Pub Dt:
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11/02/2017
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Inventors:
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Charles G. Woychik, Guilian Gao, Hong Shen, Arkalgud R. Sitaram
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Title:
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INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| HAYNES & BOONE, LLP (48259) |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 NORTH TRYON STREET |
| CHARLOTTE, NORTH CAROLINA 28255 |
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| STEWART WALSH |
| 1025 VERMONT AVE NW, SUITE 1130 |
| COGENCY GLOBAL INC. |
| WASHINGTON, DC 20005 |
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