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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
15142838
Filing Dt:
04/29/2016
Publication #:
Pub Dt:
11/02/2017
Inventors:
Hanyi Ding, Kai D. Feng, Chengwen Pei, Ping-Chuan Wang
Title:
ISOLATION STRUCTURES FOR CIRCUITS SHARING A SUBSTRATE
Assignment: 1
Reel/Frame:
038424/0686Recorded: 04/29/2016Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/28/2016
Exec Dt:
04/28/2016
Exec Dt:
04/28/2016
Exec Dt:
04/28/2016
Assignee:
PO BOX 309
UGLAND HOUSE
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104
Correspondent:
WILLIAM R. ALLEN
312 WALNUT STREET
SUITE 1400
CINCINNATI, OH 45202
Assignment: 2
Reel/Frame:
056987/0001Recorded: 05/12/2021Pages: 1045
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/17/2020
Assignee:
440 STONE BREAK ROAD EXTENSION
MALTA, NEW YORK 12020
Correspondent:
BENJAMIN PETERSEN
1460 EL CAMINO REAL, 2ND FLOOR
SHEARMAN & STERLING LLP
MENLO PARK, CA 94025

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