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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/14/2019
Application #:
15531253
Filing Dt:
05/26/2017
Publication #:
Pub Dt:
11/09/2017
Inventors:
Liqiang Zhang, Ling Shen, Hui Wang, Ya Qun Liu, Wei Jun Wang, Hong Min Huang
Title:
HIGH PERFORMANCE THERMAL INTERFACE MATERIALS WITH LOW THERMAL IMPEDANCE
Assignment: 1
Reel/Frame:
042789/0475Recorded: 06/22/2017Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/23/2017
Exec Dt:
05/23/2017
Exec Dt:
05/24/2017
Exec Dt:
05/23/2017
Exec Dt:
06/09/2017
Exec Dt:
05/23/2017
Assignee:
115 TABOR ROAD - P.O. BOX 377
HONEYWELL WORLD HEADQUARTERS
MORRIS PLAINS, NEW JERSEY 07950
Correspondent:
PATENT SERVICES, HONEYWELL INTERNATIONAL INC.
115 TABOR ROAD - P.O.BOX 377
HONEYWELL WORLD HEADQUARTERS
MORRIS PLAINS, NJ 07950

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