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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
10674612
Issue Dt:
06/02/2020
Application #:
15527644
Filing Dt:
06/17/2017
Publication #:
20170325336
Pub Dt:
11/09/2017
Inventors:
Hanako YORI, Hidenori ABE, Shunsuke OTAKE, Tomoaki SHIBATA, Tomonori MINEGISHI et al
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN COMPOSITION FOR FORMING FLEXIBLE RESIN LAYER
Assignment: 1
Reel/Frame:
049980/0886Recorded: 08/06/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHIBATA, TOMOAKI
Exec Dt:
05/23/2017
YORI, HANAKO
Exec Dt:
05/23/2017
MINEGISHI, TOMONORI
Exec Dt:
05/23/2017
ABE, HIDENORI
Exec Dt:
06/01/2017
MASUKO, TAKASHI
Exec Dt:
05/29/2017
OTAKE, SHUNSUKE
Exec Dt:
06/19/2017
Assignee:
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-6606
Correspondent:
FITCH, EVEN, TABIN & FLANNERY
120 S LASALLE STREET
SUITE 2100
CHICAGO, IL 60603
Assignment: 2
Reel/Frame:
062917/0865Recorded: 03/02/2023Pages: 21
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI CHEMICAL COMPANY, LTD.
Exec Dt:
10/01/2020
Assignee:
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME
TOKYO, JAPAN 100-6606
Correspondent:
ALAN E. SCHIAVELLI
700 12TH STREET NW, SUITE 700
WASHINGTON, DC 20005
Assignment: 3
Reel/Frame:
062946/0125Recorded: 03/03/2023Pages: 21
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
SHOWA DENKO MATERIALS CO., LTD.
Exec Dt:
01/01/2023
Assignee:
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8518
Correspondent:
ALAN E. SCHIAVELLI
700 12TH STREET NW, SUITE 700
WASHINGTON, DC 20005
Assignment: 4
Reel/Frame:
066599/0037Recorded: 02/14/2024Pages: 40
Conveyance:
CHANGE OF ADDRESS
Assignor:
RESONAC CORPORATION
Exec Dt:
10/01/2023
Assignee:
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME
MINATO-KU
TOKYO, JAPAN 105-7325
Correspondent:
ALAN E. SCHIAVELLI
SUITE 2100
120 SOUTH LASALLE STREET
CHICAGO, IL 60603

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