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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10629456
Issue Dt:
04/21/2020
Application #:
15517725
Filing Dt:
04/07/2017
Publication #:
20170330768
Pub Dt:
11/16/2017
Inventors:
Yun Liu, Yuhua Lee, Chengsheng Ku, Chingming Liu, Mengming Zhu, Dusan Golubovic et al
Title:
MOLDED PACKAGE AND METHOD OF MANUFACTURE
Assignment: 1
Reel/Frame:
043108/0001Recorded: 07/07/2017Pages: 90
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
LUMILEDS LLC
Exec Dt:
06/30/2017
Assignee:
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET
NEW YORK, NEW YORK 10005
Correspondent:
JOANNA MCCALL
1025 VERMONT AVE NW, SUITE 1130
COGENCY GLOBAL INC.
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
051574/0061Recorded: 01/21/2020Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIU, YUN
Exec Dt:
02/14/2019
LEE, YUHUA
Exec Dt:
06/13/2019
KU, CHENGSHENG
Exec Dt:
01/10/2020
LIU, CHINGMING
Exec Dt:
02/01/2019
ZHU, MENGMING
Exec Dt:
02/22/2019
GOLUBOVIC, DUSAN
Exec Dt:
02/02/2019
HUANG, YU JIE
Exec Dt:
02/14/2019
Assignee:
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5
EINDHOVEN, NETHERLANDS 5656 AE
Correspondent:
LUMILEDS (PLG) ATTN: MONICA WARD
370 WEST TRIMBLE ROAD
SAN JOSE, CA 95131

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