Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15527779
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Filing Dt:
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05/18/2017
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Publication #:
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Pub Dt:
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11/16/2017
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Inventors:
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Masaharu Yamamoto, Masayuki Yokota
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Title:
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METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT HOUSING PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-70, KONAN 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 108-8224 |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
| 1250 CONNECTICUT AVENUE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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