Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/05/2019
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Application #:
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15531243
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Filing Dt:
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05/26/2017
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Publication #:
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Pub Dt:
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11/16/2017
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Inventors:
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Quanbo Zou, Zhe Wang
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Title:
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ASSEMBLING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF FLIP-DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 268 DONGFANG ROAD |
| HI-TECH INDUSTRY DISTRICT |
| WEIFANG CITY, SHANDONG, CHINA 261031 |
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| HULTQUIST IP |
| P.O. BOX 14329 |
| RESEARCH TRIANGLE PA, NC 27709 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 10, GOER PHASE II INDUSTRIAL PARK |
| NO. 102, RONGHUA ROAD, RONGHUA COMMUNITY, XINCHENG SUBDISTRICT OFFICE, HIGH TECH DEVELOPMENT ZONE |
| WEIFANG CITY, SHANDONG, CHINA |
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| BAKER BOTTS LLP |
| 30 ROCKEFELLER PLAZA |
| 44TH FLOOR |
| NEW YORK, NY 10112 |
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