Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/2021
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Application #:
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15528739
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Filing Dt:
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05/22/2017
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Publication #:
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Pub Dt:
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11/23/2017
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Inventors:
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Tomoya YAMAZAWA, Haruyuki YOSHII
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Title:
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LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR USE AS SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3993 NIGORIKAWA, KITA-KU, NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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