Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2018
|
Application #:
|
15660958
|
Filing Dt:
|
07/27/2017
|
|
Publication #:
|
|
Pub Dt:
|
11/23/2017
| | | | |
|
Inventors:
|
R. Scott West, Mike Kwon, Tao Tong, Michael Solomensky
|
|
Title:
|
Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 46430 FREMONT BOULEVARD |
| FREMONT, CALIFORNIA 94538 |
|
|
|
|
| IMPERIUM PATENT WORKS |
| P.O. BOX 607 |
| PLEASANTON, CA 94566 |
|
|
Search Results as of:
05/27/2024 12:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
