Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/25/2018
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Application #:
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15597115
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Filing Dt:
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05/16/2017
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Publication #:
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Pub Dt:
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12/07/2017
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Inventors:
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KOJI KAWAKITA, TAKASHI ICHIRYU, MASANORI NOMURA
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Title:
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ELECTRONIC COMPONENT PACKAGE INCLUDING SEALING RESIN LAYER, METAL MEMBER, CERAMIC SUBSTRATE, AND ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1006, OAZA KADOMA, KADOMA-SHI |
OSAKA, JAPAN 571-8501 |
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PANASONIC IP MANAGEMENT CO., LTD. |
7F OBP PANASONIC TOWER |
1-61, SHIROMI 2-CHOME, CHUO-KU |
OSAKA, 540-6207 JAPAN |
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