Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/14/2019
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Application #:
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15683065
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Filing Dt:
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08/22/2017
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Publication #:
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Pub Dt:
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12/28/2017
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Inventors:
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Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
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Title:
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Method of Manufacturing a Package-on-Package Type Semiconductor Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON ST., FLOOR 34 |
| CHICAGO, IL 60661 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 333 SOUTH HOPE STREET |
| 19TH FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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| MCGUIREWOODS LLP |
| 1750 TYSONS BOULEVARD |
| SUITE 1800 |
| TYSONS, VA 22102 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 B RIVER VALLEY ROAD |
| #15-02/04 |
| VALLEY POINT, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| 34TH FLOOR |
| CHICAGO, IL 60661 |
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