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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/02/2018
Application #:
15196937
Filing Dt:
06/29/2016
Publication #:
Pub Dt:
01/04/2018
Inventors:
Saikumar Jayaraman, John S. Guzek, Yidnekachew S. Mekonnen
Title:
INTEGRATED CIRCUIT PACKAGE STACK
Assignment: 1
Reel/Frame:
039044/0367Recorded: 06/29/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/21/2016
Exec Dt:
06/21/2016
Exec Dt:
06/20/2016
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWABE, WILLIAMSON & WYATT, P.C.
1211 SW FIFTH AVENUE, SUITE 1600
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
054772/0918Recorded: 12/16/2020Pages: 17
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/13/2020
Assignee:
1600 AMPHITHEATRE PARKWAY
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
20 COMMERCE DR.
CRANFORD, NJ 07016

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