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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/28/2020
Application #:
15546373
Filing Dt:
07/26/2017
Publication #:
Pub Dt:
01/25/2018
Inventors:
Kosuke NAKANO, Minoru HATTA, Makoto ENDO
Title:
POLYAMIDE MOULDING COMPOSITION AND MOULDED ARTICLE MADE FROM THIS MOULDING COMPOSITION
Assignment: 1
Reel/Frame:
043099/0717Recorded: 07/26/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/23/2017
Exec Dt:
07/23/2017
Exec Dt:
07/23/2017
Assignee:
VIA INNOVATIVA 1
DOMAT/EMS, SWITZERLAND 7013
Correspondent:
LEYDIG VOIT & MAYER, LTD
TWO PRUDENTIAL PLAZA, SUITE 4900
180 NORTH STETSON AVENUE
CHICAGO, IL 60601-6731

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