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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/07/2020
Application #:
15541434
Filing Dt:
07/03/2017
Publication #:
Pub Dt:
01/25/2018
Inventors:
Bin LUO, Hua WANG, Shouyin YE, Xuefei TANG, Jianbo LING, Jianming YE
Title:
CONFIGURATION AND TESTING METHOD AND SYSTEM FOR FPGA CHIP USING BUMPING PROCESS
Assignment: 1
Reel/Frame:
042896/0606Recorded: 07/05/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/14/2017
Exec Dt:
06/14/2017
Exec Dt:
06/14/2017
Exec Dt:
06/14/2017
Exec Dt:
06/14/2017
Exec Dt:
06/14/2017
Assignee:
2ND FLOOR, BUILDING 2, NO.351 GUOSHOUJING ROAD
PUDONG NEW AREA, SHANGHAI, CHINA 201203
Correspondent:
MAIER & MAIER, PLLC
345 SOUTH PATRICK STREET
ALEXANDRIA, VA 22314

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