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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/21/2019
Application #:
15399237
Filing Dt:
01/05/2017
Publication #:
Pub Dt:
02/01/2018
Inventors:
Wan-Chun Kuan, Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng
Title:
Integrated Circuit Structure having Crown-Shaped Semiconductor Strips and Recesses in the Substrate from Etched Dummy Fins
Assignment: 1
Reel/Frame:
040862/0329Recorded: 01/05/2017Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/03/2017
Exec Dt:
01/04/2017
Exec Dt:
01/03/2017
Exec Dt:
01/03/2017
Assignee:
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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