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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/31/2020
Application #:
15548061
Filing Dt:
08/01/2017
Publication #:
Pub Dt:
02/01/2018
Inventors:
Dong-Sik KIM, Jae-Ki LEE, Hyun-Woo CHOI, Dae-Ki LEE, Ye-Rok PARK, Byung-Kyu LIM et al
Title:
THERMOELECTRIC MODULE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
043174/0089Recorded: 08/02/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/06/2017
Exec Dt:
07/06/2017
Exec Dt:
07/06/2017
Exec Dt:
07/06/2017
Exec Dt:
07/06/2017
Exec Dt:
07/06/2017
Exec Dt:
07/06/2017
Exec Dt:
07/11/2017
Assignee:
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
AMPACC LAW GROUP, PLLC
6100 219TH ST. SW
SUITE 580
MOUNTLAKE TERRACE, WA 98043

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