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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10062656
Issue Dt:
08/28/2018
Application #:
15236526
Filing Dt:
08/15/2016
Publication #:
20180047682
Pub Dt:
02/15/2018
Inventors:
Chao-Ching Chang, Sheng-Chan Li, Wen-Jen Tsai, Chih-Hui Huang, Jian-Shin Tsai et al
Title:
COMPOSITE BOND STRUCTURE IN STACKED SEMICONDUCTOR STRUCTURE
Assignment: 1
Reel/Frame:
039630/0460Recorded: 09/06/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHANG, CHAO-CHING
Exec Dt:
08/23/2016
LI, SHENG-CHAN
Exec Dt:
08/22/2016
TSAI, WEN-JEN
Exec Dt:
08/23/2016
HUANG, CHIH-HUI
Exec Dt:
08/19/2016
TSAI, JIAN-SHIN
Exec Dt:
08/26/2016
WU, CHENG-YI
Exec Dt:
08/31/2016
LIN, YI-MING
Exec Dt:
08/23/2016
LIN, MIN-HUI
Exec Dt:
08/23/2016
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339

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