Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/30/2019
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Application #:
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15554653
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Filing Dt:
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08/30/2017
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Publication #:
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Pub Dt:
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02/22/2018
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Inventor:
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Yanmei SUN
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Title:
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INTEGRATED STRUCTURE OF MEMS MICROPHONE AND PRESSURE SENSOR AND MANUFACTURING METHOD FOR THE INTEGRATED STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 268 DONGFANG ROAD, HI-TECH INDUSTRY DISTRICT |
| WEIFANG CITY, SHANDONG, CHINA 261031 |
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| STEVEN J. SCHWARZ |
| 600 MASSACHUSETTS AVENUE NW |
| VENABLE LLP |
| WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 10, GOER PHASE II INDUSTRIAL PARK |
| NO. 102, RONGHUA ROAD, RONGHUA COMMUNITY, XINCHENG SUBDISTRICT OFFICE, HIGH TECH DEVELOPMENT ZONE |
| WEIFANG CITY, SHANDONG, CHINA |
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| BAKER BOTTS LLP |
| 30 ROCKEFELLER PLAZA |
| 44TH FLOOR |
| NEW YORK, NY 10112 |
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