Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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15600247
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Filing Dt:
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05/19/2017
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Publication #:
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Pub Dt:
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02/22/2018
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Inventors:
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Jingjing Liu, Adolph Miller Allen, Srinivas D. Nemani, Bhargav Citla, Andrej Halabica et al
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Title:
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HIGH DENSITY, LOW STRESS AMORPHOUS CARBON FILM, AND PROCESS AND EQUIPMENT FOR ITS DEPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| KILPATRICK TOWNSEND & STOCKTON LLP / AMA |
| 1100 PEACHTREE STREET |
| SUITE 2800 |
| ATLANTA, GA 30309 |
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