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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10535697
Issue Dt:
01/14/2020
Application #:
15803913
Filing Dt:
11/06/2017
Publication #:
20180061880
Pub Dt:
03/01/2018
Inventors:
Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung et al
Title:
Structure and Method for 3D Image Sensor
Assignment: 1
Reel/Frame:
044036/0480Recorded: 11/06/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KAO, MIN-FENG
Exec Dt:
12/17/2013
YAUNG, DUN-NIAN
Exec Dt:
12/17/2013
LIU, JEN-CHENG
Exec Dt:
12/17/2013
CHUANG, CHUN-CHIEH
Exec Dt:
12/17/2013
HUNG, FENG-CHI
Exec Dt:
12/17/2013
TSAI, SHUANG-JI
Exec Dt:
12/17/2013
LIN, JENG-SHYAN
Exec Dt:
12/17/2013
TSAI, SHU-TING
Exec Dt:
12/17/2013
HSU, WEN-I
Exec Dt:
12/17/2013
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 2
Reel/Frame:
064180/0278Recorded: 06/30/2023Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Exec Dt:
06/20/2023
Assignee:
ADVANCED MANUFACTURING INNOVATIONS INC.
251 LITTLE FALLS DRIVE
WILMINGTON, DELAWARE 19808
Correspondent:
MICHAEL MCCARTNEY
1891 ROBERTSON RD. SUITE 100
OTTAWA, K2H5B7 CANADA

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