Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2021
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Application #:
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15561488
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Filing Dt:
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09/25/2017
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Publication #:
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Pub Dt:
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03/08/2018
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Inventor:
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Mitsuo EBISAWA
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Title:
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SOLDER PROCESSING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LAB. WING, KEIHANNA PLAZA, 1-7, HIKARIDAI, SEIKA-CHO |
| SOURAKU-GUN, KYOTO, JAPAN 619-0237 |
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| METROLEXIS LAW GROUP, PLLC - JP |
| 900 17TH STREET, NW. |
| SUITE 320 |
| WASHINGTON, DC 20006 |
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