Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/14/2018
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Application #:
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15259992
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Filing Dt:
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09/08/2016
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Publication #:
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Pub Dt:
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03/08/2018
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Inventors:
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MIN-FENG KAO, JEN-CHENG LIU, HSIN-HUNG CHEN, HSING-CHIH LIN, DUN-NIAN YAUNG
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Title:
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THROUGH VIA STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 2301 DUPONT DR. SUITE 510 |
| IRVINE, CA 92612 |
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