Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15812293
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Filing Dt:
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11/14/2017
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Publication #:
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Pub Dt:
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03/08/2018
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Inventors:
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SATOSHI TORIMI, MASATO SHINOHARA, YOUJI TERAMOTO, NORIHITO YABUKI, SATORU NOGAMI et al
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Title:
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METHOD FOR MANUFACTURING THIN SiC WAFER AND THIN SiC WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-12, TAKESHIMA, 5-CHOME, NISHIYODOGAWA-KU |
| OSAKA-SHI, OSAKA, JAPAN 555-0011 |
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| WHDA, LLP |
| 8500 LEESBURG PIKE, SUITE 7500 |
| TYSONS, VA 22182 |
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