Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/27/2019
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Application #:
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15696611
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Filing Dt:
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09/06/2017
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Publication #:
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Pub Dt:
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03/15/2018
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Inventors:
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Masahiko HARUMOTO, Koji KANEYAMA, Yuji TANAKA, Masaya ASAI
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Title:
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ETCHING DEVICE, SUBSTRATE PROCESSING APPARATUS, ETCHING METHOD AND SUBSTRATE PROCESSING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME |
| HORIKAWA-DORI, KAMIGYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 602-8585 |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE DOC DATE OF THE THIRD INVENTOR PREVIOUSLY RECORDED ON REEL 043502 FRAME 0538. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME |
| HORIKAWA-DORI, KAMIGYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 602-8585 |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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