Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/15/2019
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Application #:
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15824164
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Filing Dt:
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11/28/2017
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Publication #:
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Pub Dt:
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03/22/2018
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Inventors:
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Takehiko SUMI, Kiyotaka KAWAI
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Title:
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RESIN PANEL AND MOLDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 598-1, TATSUMAE-CHO, NAKADACHIURI-SAGARU |
| KARASUMADORI, KAMIGYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 6020912 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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