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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/20/2020
Application #:
15272758
Filing Dt:
09/22/2016
Publication #:
Pub Dt:
03/22/2018
Inventors:
Li-Wen HUNG, John U. KNICKERBOCKER, Leathen SHI, Cornelia TSANG YANG, Bucknell C. WEBB
Title:
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCESS, EQUIPMENT STRESS MANAGEMENT, AND THERMAL MANAGEMENT
Assignment: 1
Reel/Frame:
039829/0956Recorded: 09/22/2016Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/01/2016
Exec Dt:
09/08/2016
Exec Dt:
09/09/2016
Exec Dt:
09/01/2016
Exec Dt:
09/08/2016
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
FLEIT GIBBONS GUTMAN BONGINI & BIANCO PL
551 NW 77TH STREET, SUITE 111
BOCA RATON, FL 33487

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