Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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15615065
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Filing Dt:
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06/06/2017
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Publication #:
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Pub Dt:
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03/22/2018
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Inventors:
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FU-YUN SHEN, CONG LEI, MING-JAAN HO, HSIAO-TING HSU
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Title:
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HEAT DISSIPATION STRUCTURE, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO' AN DISTRICT |
| SHENZHEN, CHINA |
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| NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
| QINHUANGDAO, CHINA |
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| STEVEN M. REISS |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO AN DISTRICT |
| SHENZHEN, CHINA |
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| ZHIGANG MA |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO AN DISTRICT |
| SHENZHEN, CHINA |
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| ZHIGANG MA |
| 550 S. HOPE |
| SUITE 2825 |
| LOS ANGELES, CA 90071 |
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