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Patent Assignment Abstract of Title
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Total Assignments: 6
Patent #:
10038002
Issue Dt:
07/31/2018
Application #:
15296858
Filing Dt:
10/18/2016
Publication #:
20180108669
Pub Dt:
04/19/2018
Inventors:
Hongbin Zhu, Zhenyu Lu, Gordon Haller, Jie Sun, Randy J. Koval, John Hopkins
Title:
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION
Assignment: 1
Reel/Frame:
045484/0480Recorded: 03/02/2018Pages: 3
Conveyance:
EMPLOYMENT AGREEMENT IN LIEU OF ASSIGNMENT
Assignor:
LU, ZHENYU
Exec Dt:
08/09/2004
Assignee:
MICRON TECHNOLOGY, INC.
8000 SO. FEDERAL WAY
BOISE, IDAHO 83716-9632
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402-0938
Assignment: 2
Reel/Frame:
041671/0902Recorded: 02/10/2017Pages: 16
Conveyance:
SUPPLEMENT NO. 2 TO PATENT SECURITY AGREEMENT
Assignor:
MICRON TECHNOLOGY, INC.
Exec Dt:
10/24/2016
Assignee:
MORGAN STANLEY SENIOR FUNDING, INC.
1300 THAMES STREET
4TH FLOOR
BALTIMORE, MARYLAND 21231
Correspondent:
GENEVIEVE DORMENT, ESQ.
SIMPSON THACHER & BARTLETT LLP
425 LEXINGTON AVENUE
NEW YORK, NY 10017
Assignment: 3
Reel/Frame:
045136/0669Recorded: 03/07/2018Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ZHU, HONGBIN
Exec Dt:
04/18/2017
HALLER, GORDON
Exec Dt:
12/20/2017
SUN, JIE
Exec Dt:
05/09/2017
KOVAL, RANDY J
Exec Dt:
03/07/2018
HOPKINS, JOHN
Exec Dt:
08/16/2017
Assignee:
MICRON TECHNOLOGY, INC.
8000 SO. FEDERAL WAY
BOISE, IDAHO 83716-9632
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402-0938
Assignment: 4
Reel/Frame:
047540/0001Recorded: 07/13/2018Pages: 843
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MICRON TECHNOLOGY, INC.
Exec Dt:
07/03/2018
MICRON SEMICONDUCTOR PRODUCTS, INC.
Exec Dt:
07/03/2018
Assignee:
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
10 S. DEARBORN
7TH FLOOR
CHICAGO, ILLINOIS 60603
Correspondent:
MARCELA ROBLEDO
2475 HANOVER STREET
PALO ALTO, CA 94304
Assignment: 5
Reel/Frame:
050680/0268Recorded: 10/09/2019Pages: 18
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Exec Dt:
07/31/2019
Assignee:
MICRON TECHNOLOGY, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL
ONE MARKET, SPEAR TOWER, SUITE 3300
SAN FRANCISCO, CA 94105
Assignment: 6
Reel/Frame:
051028/0001Recorded: 11/12/2019Pages: 834
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Exec Dt:
07/31/2019
Assignees:
MICRON TECHNOLOGY, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
MICRON SEMICONDUCTOR PRODUCTS, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL
ONE MARKET, SPEAR TOWER, SUITE 3300
SAN FRANCISCO, CA 94105

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