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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
03/10/2020
Application #:
15792484
Filing Dt:
10/24/2017
Publication #:
Pub Dt:
04/26/2018
Inventors:
Vipul Jain, Robert J. McMorrow, Shamsun Nahar, Noyan Kinayman, Kristian N. Madsen et al
Title:
FLIP-CHIP BEAMFORMING INTEGRATED CIRCUIT WITH INTEGRAL THERMAL MASS
Assignment: 1
Reel/Frame:
047228/0604Recorded: 06/14/2018Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/14/2017
Exec Dt:
11/15/2017
Exec Dt:
11/27/2017
Exec Dt:
11/14/2017
Exec Dt:
11/14/2017
Exec Dt:
11/14/2017
Assignee:
11236 EL CAMINO REAL
SUITE 100
SAN DIEGO, CALIFORNIA 92130
Correspondent:
SUNSTEIN KANN MURPHY & TIMBERS LLP
125 SUMMER STREET
BOSTON, MA 02110
Assignment: 2
Reel/Frame:
062113/0906Recorded: 12/08/2022Pages: 14
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/08/2022
Assignee:
296 CONCORD ROAD
BILLERICA, MASSACHUSETTS 01821
Correspondent:
JONES DAY
250 VESEY STREET
NEW YORK, NY 10281-1047
Assignment: 3
Reel/Frame:
066510/0312Recorded: 02/07/2024Pages: 11
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/02/2024
Assignee:
5355 MIRA SORRENTO PLACE
SUITE 300
SAN DIEGO, CALIFORNIA 92121
Correspondent:
STEWART WALSH
1025 CONNECTICUT AVE NW, SUITE 712
COGENCY GLOBAL INC.
WASHINGTON, DC 20036

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