Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15341733
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Filing Dt:
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11/02/2016
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Publication #:
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Pub Dt:
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05/03/2018
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Inventors:
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Shu Chuen HO, Teng Hock KUAH, Jiapei DING, Jian Xiong SU, Ravindra RAGHAVENDRA
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Title:
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MOLDING APPARATUS INCLUDING A COMPRESSIBLE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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